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International Conference on Electronics Packaging and Assembly Engineering

IC-EPAE

Fri, Oct 23, 2026- Sat, Oct 24, 2026
Ashdod, Israel

Event Starts

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IC-EPAE

Fri, Oct 23, 2026- Sat, Oct 24, 2026
Ashdod, Israel
Conference Overview

The main purpose of International Conference on Electronics Packaging and Assembly Engineering is to bring industry professionals, experts, academicians, and scholars to discuss their expertise for better collaboration in the field.

Official Website
Important Dates

Start Date

Friday, October 23, 2026

End Date

Saturday, October 24, 2026

Registration Deadline

Thursday, October 8, 2026

Submission Deadline

Saturday, October 3, 2026

Conference Agenda
TimingSessions
09:00 AM – 09:30 AMRegistration & Welcome Coffee Kit Collection
09:30 AM – 09:45 AMNetworking Tea Break
09:45 AM – 10:30 AMOpening Plenary Session: Welcome Address & Keynote
10:30 AM – 01:00 PMSession I
01:00 PM – 01:30 PMLunch Break
01:30 PM – 04:00 PMSession II
04:05 PM – 04:15 PMGroup Photo & Final Networking Session
04:15 PM – 05:00 PMClosing Address: Reflections & Awards Presentation

Committee Members

Meet the distinguished experts guiding the conference.

Bishnu Pada Bose

Bishnu Pada Bose

Dr. Shashi Mehta

Dr. Shashi Mehta

Ganesh Divakar

Ganesh Divakar

Speakers

Learn from renowned speakers and industry leaders.

Arpan Kharva

Arpan Kharva

David Adewuyi

David Adewuyi

Dr. Amira Hassenin

Dr. Amira Hassenin

Organizer

SNRI

Alex Stewart
support@snrischolars.com

Indexed In

  • Scopus
  • DOI Directory
  • Google Scholar
  • Springer
Venue
will update soon

Ashdod, Israel

Quick Info
TypeConference
CountryIsrael
MonthOct-26

Find What Next

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Electrical and Electronics Engineering Conferences in Ashdod

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